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B:
Plastic Shrink DIP (70 mil spacing)
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DW:
Small Outline Integrated Circuit (Wide-Body SOIC)
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FA:
7 x 7 mm Quad Flat Pack (QFP)
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FB:
10 x 10 mm Quad Flat Pack (QFP)
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FE:
Windowed Ceramic Quad Flat Pack (CQFP) - Samples Only
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FN:
Plastic Leaded Chip Carrier (PLCC)
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FS:
Windowed Ceramic Leaded Chip Carrier (CLCC) - Samples Only
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FT:
28 x 28 mm Quad Flat Pack (QFP)
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FU:
14 x 14 mm Quad Flat Pack (QFP)
-
FZ:
Windowed Ceramic Quad Flat Pack (CQFP) - Samples Only
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K:
Windowed Ceramic Shrink DIP (cersdip) - Samples Only
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L:
Ceramic Sidebraze DIP
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P:
Plastic DIP (100 mil spacing)
-
PU:
14 x 14 mm Thin Quad Flat Pack (TQFP)
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PV:
20 x 20 mm Thin Quad Flat Pack (TQFP)
-
S:
Windowed Ceramic DIP (Cerdip) - Samples Only